Method of manufacturing proximity sensor and manufacturing system for proximity sensor

ABSTRACT

A method of manufacturing a proximity sensor and a manufacturing system for the proximity sensor capable of improving detection precision or expanding a detectable range are provided. 
     A method of manufacturing a proximity sensor outputting presence or absence of a detection object or a position of the detection object as a detection result is provided. The manufacturing method includes: disposing the proximity sensor in a temperature-changeable environment; setting an environment of the proximity sensor to a plurality of different temperatures respectively and storing temperature detected by the temperature detection part of the proximity sensor in association with the detection result output by the control calculation part at each temperature; determining a characteristic parameter unique to a target proximity sensor based on the stored temperature and detection result; and setting the determined characteristic parameter for the target proximity sensor.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority of Japan patent application serialno. 2017-183372, filed on Sep. 25, 2017. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND Technical Field

The disclosure relates to a method of manufacturing a proximity sensorand a manufacturing system for the proximity sensor.

Description of Related Art

In fields of factory automation (FA) technologies, proximity sensorsoutputting presence or absence of a detection object or a distance to adetection object as a detection result are used. For proximity sensors,a plurality of detection schemes have been proposed. For example, inhigh frequency oscillation type proximity sensors, high frequency wavesare radiated from primary coils and detection is executed based onchanges in waveforms occurring in secondary coils (which are common tothe primary coils in some cases).

For such proximity sensors, for example, Japanese Unexamined PatentApplication Publication No. H05-218845 (Patent Document 1) discloses aconfiguration in which a programming unit is mounted in order to adjusta proximity switch in accordance with a desired operation distance.

Detection characteristics of the proximity sensors are affected due to achange in an ambient temperature are known. For example, JapaneseUnexamined Patent Application Publication No. H01-233913 (PatentDocument 2) discloses a learning type temperature compensation circuit.

-   [Patent Document 1] Japanese Unexamined Patent Application    Publication No. H05-218845-   [Patent Document 2] Japanese Unexamined Patent Application    Publication No. H01-233913

There is a request for improving detection precision of a proximitysensor or expanding a detectable range of the proximity sensor. In theconfiguration disclosed in Japanese Unexamined Patent ApplicationPublication No. H05-218845 (Patent Document 1), an operation distance ofan individual proximity switch can be set. However, in such aconfiguration, the above-described request may not be satisfied.

In Japanese Unexamined Patent Application Publication No. H01-233913(Patent Document 2), the detection precision can be improved by thetemperature compensation circuit. However, an influence of a variationin component characteristics or a manufacturing process may not bereduced.

SUMMARY

The disclosure is to provide a method of manufacturing a proximitysensor and a manufacturing system for the proximity sensor capable ofimproving detection precision or expanding a detectable range.

According to an embodiment of the disclosure, there is provided a methodof manufacturing a proximity sensor outputting presence or absence of adetection object or a position of the detection object as a detectionresult. The method includes disposing the proximity sensor in atemperature-changeable environment. The proximity sensor includes adetection part that includes a detection coil and a capacitor, anoscillation circuit that excites the detection part, a temperaturedetection part that detects a temperature inside a casing of theproximity sensor, and a control calculation part that outputs a signalindicating a distance to the detection object as the detection resultbased on a signal change occurring in the detection part. The methodfurther includes setting an environment of the proximity sensor to aplurality of different temperatures respectively and storing temperaturedetected by the temperature detection part of the proximity sensor inassociation with the detection result output by the control calculationpart at each temperature; determining a characteristic parameter uniqueto a target proximity sensor based on the stored temperature anddetection result; and setting the determined characteristic parameterfor the target proximity sensor.

According to another embodiment of the disclosure, there is provided amanufacturing system for a proximity sensor outputting presence orabsence of a detection object or a position of the detection object as adetection result. The manufacturing system includes a thermostaticchamber configured to accommodate one proximity sensor or a plurality ofthe proximity sensors and change a temperature environment. Theproximity sensor includes a detection part that includes a detectioncoil and a capacitor, an oscillation circuit that excites the detectionpart, a temperature detection part that detects a temperature inside acasing of the proximity sensor, and a control calculation part thatoutputs a signal indicating a distance to the detection object as thedetection result based on a signal change occurring in the detectionpart. The manufacturing system further includes a storage unitconfigured to set an environment of the proximity sensor to a pluralityof different temperatures respectively and store temperature detected bythe temperature detection part of the proximity sensor in associationwith the detection result output by the control calculation part at eachtemperature; a determination unit configured to determine acharacteristic parameter unique to a target proximity sensor based onthe stored temperature and detection result; and a setting unitconfigured to set the determined characteristic parameter for the targetproximity sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a proximity sensor accordingto an embodiment.

FIG. 2 is a sectional view illustrating the proximity sensor taken alongthe arrow line A-A illustrated in FIG. 1.

FIG. 3 is a block diagram illustrating an example of a configuration ofa processing circuit included in the proximity sensor according to theembodiment.

FIGS. 4(A), 4(B) and 4(C) are diagrams for describing an operationprinciple of the proximity sensor according to the embodiment.

FIG. 5 is a schematic view illustrating a functional configuration of amain circuit of the proximity sensor according to the embodiment.

FIGS. 6(A) and 6(B) are diagrams for describing a temperature change ofdetection characteristics occurring in a change in detectioncharacteristics and compensation for the temperature change.

FIG. 7 is a schematic view for describing a method of determiningcharacteristic parameter of the proximity sensor according to theembodiment.

FIG. 8 is a schematic view illustrating an example of a hardwareconfiguration of a setting device illustrated in FIG. 7.

FIG. 9 is a flowchart illustrating a processing procedure for amanufacturing method including determination and setting of thecharacteristic parameter of the proximity sensor according to theembodiment.

FIG. 10 is a diagram illustrating an example of a data structure ofcollected data stored in the setting device of a manufacturing systemaccording to the embodiment.

DESCRIPTION OF THE EMBODIMENTS

Embodiments of the disclosure will be described in detail with referenceto the drawings. The same reference numerals are given to the same orequivalent portions in the drawings and the description thereof will notbe repeated.

A. CONFIGURATION OF PROXIMITY SENSOR

First, a configuration of a proximity sensor 1 according to anembodiment will be described. The proximity sensor 1 according to theembodiment outputs presence or absence or a position of a detectionobject W as a detection result. A conductive object such as a metal isassumed as the detection object W.

FIG. 1 is a perspective view illustrating the proximity sensor 1according to the embodiment. FIG. 2 is a sectional view illustrating theproximity sensor 1 taken along the arrow line A-A illustrated in FIG. 1.

Referring to FIG. 1, the proximity sensor 1 includes a body 2 and a leadwire 4 connected to the body 2. Nuts 12 and 14 and a washer 10 disposedbetween the nuts 12 and 14 may be further mounted on the proximitysensor 1.

The body 2 includes a cylindrical casing 6 and a circular detectionsurface 8 disposed at one end of the casing 6. The detection surface 8may be formed as a part of a cap fitted onto the casing 6. Screw groovesfor the nuts 12 and 14 are forming on the surface of the casing 6.Further, an operation indication lamp or the like (not illustrated) maybe disposed in the body 2.

The nuts 12 and 14 and the washer 10 are used to mount the body 2 on aholding member of a device or the like. For example, the body 2 can befixed to the support member by interposing a part of fitting (forexample, an L-shaped fitting) between the nuts 12 and 14.

Referring to FIG. 2, a detection coil 16, a ferrite core 18, and aprocessing circuit 20 in which an element is disposed on a substrate areincluded inside the casing 6 of the body 2. The inside of the casing 6is filled with a resin and is sealed from the outside.

An annular or a substantially annular coil is used as the detection coil16. A substantial center of the detection coil 16 is located on acentral axis M of the casing 6. The detection coil 16 is electricallyconnected to the processing circuit 20. The processing circuit 20receives power via the lead wire 4 and outputs a detection result or thelike to the outside.

An external temperature sensor 44 may be disposed near the detectioncoil 16. A temperature detected by the external temperature sensor 44 isoutput to the processing circuit 20.

FIG. 1 illustrates a configuration in which the lead wire 4 is directlyconnected to the body 2, but both the lead wire 4 and the body 2 may beconnected as a detachable connector. As the configuration in which thebody 2 is disposed at a predetermined position, not only theconfiguration in which the nuts 12 and 14 and the washer 10 illustratedin FIG. 1 are used but also any support member can be used. Theproximity sensor 1 according to the embodiment mainly has the body 2with a different configuration from the technology of the related artand any structure attached to the support member can be adopted.

B. CONFIGURATION OF PROCESSING CIRCUIT

Next, an example of a configuration of the processing circuit 20included in the proximity sensor 1 will be described. FIG. 3 is a blockdiagram illustrating an example of a configuration of the processingcircuit 20 included in the proximity sensor 1 according to theembodiment.

Referring to FIG. 3, the processing circuit 20 includes a main circuit30, an interface circuit 62, and a protection circuit 60. The maincircuit 30 is connected to a detection part 22 including the detectioncoil 16 and a capacitor 17.

The main circuit 30 oscillates the detection coil 16 and monitors anoscillation state of the detection coil 16. More specifically, the maincircuit 30 includes a control calculation circuit 32, an oscillationcircuit 34, an analog/digital conversion circuit (hereinafter alsoreferred to as an “analog-to-digital (A/D) conversion circuit”) 36, aninternal temperature sensor 38, a storage part 40, and a power circuit50.

The control calculation circuit 32 is a circuit that executes a mainprocess in the processing circuit 20. More specifically, the controlcalculation circuit 32 outputs an oscillation control signal to theoscillation circuit 34, receives an input of a detection signal (digitalsignal) from the A/D conversion circuit 36, and executes a process ofdetecting presence or absence of the detection object W and/or a processof detecting a distance to the detection object W. At this time, thecontrol calculation circuit 32 compensates temperature dependency ofelectric characteristics of the detection part 22 with reference to thetemperature detected by the internal temperature sensor 38 and/or theexternal temperature sensor 44 and a characteristic parameter 42 storedin the storage part 40.

In the embodiment, each unique value of the proximity sensor 1 is storedas the characteristic parameter 42. That is, the characteristicparameter 42 unique to the proximity sensor 1 is stored in advance inthe storage part 40. A determination process for the characteristicparameter 42 and a compensation process using the characteristicparameter 42 will be described later.

In this way, the control calculation circuit 32 calculates a signalindicating a distance to the detection object W by processing a digitalsignal from the A/D conversion circuit 36, compensates the calculatedsignal using the characteristic parameter 42 stored in the storage part40, and then outputs the compensated signal as a detection result.

The oscillation circuit 34 generates an excitation current with a highfrequency in accordance with an oscillation control signal from thecontrol calculation circuit 32 and excites the detection part 22. Thefrequency of the excitation current from the oscillation circuit 34 isdetermined in consideration of a resonant frequency or the like of thedetection part 22.

The detection part 22 includes the detection coil 16 and the capacitor17 connected in parallel to the detection coil 16. The detection part 22configures an LC parallel resonant circuit (LC tank circuit) inaccordance with an L component of the detection coil 16 and a Ccomponent of the capacitor 17. When the oscillation circuit 34 excitesand there is no detection object W, the LC parallel resonant circuit ofthe detection part 22 enters a resonant state. In FIG. 3, to facilitatedescription, a parallel circuit of the detection coil 16 and thecapacitor 17 is illustrated. However, the disclosure is not limitedthereto. Any circuit may be adopted as long as a resonant circuitincluding the detection coil 16 is used.

The A/D conversion circuit 36 executes A/D conversion on a voltage(analog signal) generated at both ends of the detection part 22 andoutputs a digital signal. The digital signal output from the A/Dconversion circuit 36 is provided to the control calculation circuit 32.That is, the A/D conversion circuit 36 detects a signal change occurringin the detection part 22 and outputs a digital signal indicating thedetected signal change.

The storage part 40 is a rewritable nonvolatile storage device. Forexample, an electrically erasable programmable read-only memory (EEPROM)can be used. The storage part 40 stores a program and data necessary forthe control calculation circuit 32 to execute a process in addition tothe characteristic parameter 42.

In the proximity sensor 1, a temperature detection part that detects atemperature inside the casing 6 of the proximity sensor 1 is installed.

More specifically, the internal temperature sensor 38 which is anexample of the temperature detection part is disposed on the samesubstrate as the control calculation circuit 32 (a first temperaturesensor). By mounting the internal temperature sensor 38 as a part of themain circuit 30 along with the control calculation circuit 32, it ispossible to reduce cost related to the disposition of the temperaturedetection part.

The external temperature sensor 44 which is another example of thetemperature detection part is disposed at a position closer to thedetection part 22 than the internal temperature sensor 38. That is, theexternal temperature sensor 44 is disposed inside the casing 6 of theproximity sensor 1 and at a different position from the processingcircuit 20. The external temperature sensor 44 may be disposed at aposition away from a heat source such as the power circuit 50 and nearthe detection part 22. The external temperature sensor 44 may bedisposed to measure the temperature of the detection part 22 with higherprecision while reducing an influence of heat generated from the powercircuit 50 or the like included in the processing circuit 20.

As the internal temperature sensor 38 and/or the external temperaturesensor 44, for example, a thermistor, a resistance thermometer formed ofplatinum or the like, or a thermocouple can be used.

It is not necessary to mount both the internal temperature sensor 38 andthe external temperature sensor 44, and only one of the temperaturesensors may be mounted.

Hereinafter, a temperature detected by the temperature detection part(the internal temperature sensor 38 and/or the external temperaturesensor 44) is collectively referred to as an “internal casingtemperature.”

The power circuit 50 receives power from an external power source andgenerates power to drive the main circuit 30 and peripheral circuits. Asthe power circuit 50, for example, a circuit including a switchingregulator is adopted.

The interface circuit 62 is a circuit that relays exchange of databetween the main circuit 30 and an external device and, for example,outputs a detection result calculated in the control calculation circuit32 to an external device and provides a control signal from an externaldevice to the control calculation circuit 32.

The interface circuit 62 outputs a signal indicating a temperaturedetected by the temperature detection parts (the internal temperaturesensor 38 and the external temperature sensor 44) to the outside.Further, the interface circuit 62 receives the characteristic parameter42 written on the storage part 40. That is, the characteristic parameterreceived by the interface circuit 62 is written on the storage part 40.The signal indicating the temperature and the exchange of thecharacteristic parameter 42 will be described later.

The protection circuit 60 suppresses serge, noise, or the like which caninvade a signal transmitted via each signal line included in the leadwire 4.

A display device or the like (not illustrated) may be connected to theproximity sensor 1. In this case, a control signal may be provided fromthe processing circuit 20 to the display device.

For example, the main circuit 30 may be packaged using an applicationspecific integrated circuit (ASIC) or the like. A mounting form for theprocessing circuit 20 is not particularly limited, but any mounting formcan be adopted.

C. OPERATION PRINCIPLE

Next, an operation principle of the proximity sensor 1 according to theembodiment will be described.

In an operation state, the detection coil 16 is excited by theoscillation circuit of the processing circuit 20 of the proximity sensor1. When an excitation current with a high frequency is supplied to thedetection coil 16 by the excitation of the oscillation circuit, ahigh-frequency magnetic field is generated from the detection coil 16.On the other hand, when the detection object W which is a metal objectapproaches the high-frequency magnetic field generated by the detectioncoil 16, an induced current flows in the detection object W by anelectromagnetic induction phenomenon and a heat loss (resistance loss)occurs in the detection object W.

An increase in the heat loss occurring in the detection object Wincreases results in an increase in an influence of the oscillationcircuit on an oscillation state of the detection coil 16, and thus anoscillation amplitude may be attenuated or the oscillation may not bemaintained. Based on a change in the oscillation state, presence orabsence of the detection object W or a distance to the detection objectW can be detected.

FIGS. 4(A), 4(B) and 4(C) are diagrams for describing an operationprinciple of the proximity sensor 1 according to the embodiment. FIG.4(A) illustrates an example of a time waveform of a detected signaldetected by the A/D conversion circuit 36 of the main circuit 30 whenthere is no detection object W within a detectable range of theproximity sensor 1. As illustrated in FIG. 4(A), when there is nodetection object W within a detectable range of the proximity sensor 1,the detection part 22 is in an oscillation state.

FIGS. 4(B) and 4(C) illustrate examples of time waveforms of thedetection signal detected by the A/D conversion circuit 36 of the maincircuit 30 when there is the detection object W within a detectablerange of the proximity sensor 1. It can be understood that anoscillation state of the time waveform illustrated in FIG. 4(B) ismaintained and the amplitude of the time waveform becomes smaller thanthe oscillation waveform illustrated in FIG. 4(A). The time waveformillustrated in FIG. 4(C) corresponds to a state in which the detectionobject W is closer to the proximity sensor 1. The time waveformillustrated in FIG. 4(C) indicates that the oscillation state is notmaintained.

As illustrated in FIG. 4(A) to FIG. 4(C), the oscillation state of thedetection part 22 is changed when the detection object W approaches theproximity sensor 1. That is, the presence or absence of the detectionobject W or the distance to the detection object W can be detected basedon the change in the oscillation state of the detection part 22.

D. DETECTION PROCESS AND TEMPERATURE COMPENSATION

Next, a detection process and temperature compensation in the proximitysensor 1 according to the embodiment will be described.

FIG. 5 is a schematic view illustrating a functional configuration ofthe main circuit 30 of the proximity sensor 1 according to theembodiment. Referring to FIG. 5, the A/D conversion circuit 36 outputs avoltage value occurring at both ends of the detection part 22 (includingthe detection coil 16 and the capacitor 17: see FIG. 3) as a digitalvalue.

The main circuit 30 is a module capable of executing an arithmeticoperation and includes a conductance calculation processing part 82, acompensation part 84, and a threshold processing part 86.

The conductance calculation processing part 82 calculates the magnitudeof conductance of the detection coil 16 based on a time change in thevoltage value output from the A/D conversion circuit 36. That is, theconductance calculation processing part 82 calculates a value equivalentto the magnitude of the conductance of the detection coil 16 based on avoltage waveform occurring at both ends of the detection coil 16. Themagnitude of the conductance indicates ease with which a current flowsin the detection coil 16. When the detection object W approaches thedetection part 22 and an induced current flowing in the detection part22 relatively increases, the current hardly flows in the detection coil16. As a result, the conductance of the detection coil 16 decreases.That is, the magnitude of the conductance indicates how difficult it isfor current to flow in the detection coil 16.

As a method of calculating the conductance, for example, a ratio of theamplitude occurring at both ends of the detection part 22 to a referenceamplitude is used to calculate the conductance. Alternatively, theconductance can also be calculated based on a time change (amplitude andphase) of the voltage occurring at both ends of the detection part 22.

A calculation result of the conductance output from the conductancecalculation processing part 82 is referred to as “DIST” meaning adistance below. The magnitude of the distance output DIST isproportional to the calculation result of the conductance. That is, thedistance output DIST indicates the magnitude of the distance between thedetection part 22 and the detection object W.

The compensation part 84 compensates a change in the detectioncharacteristics which depend on a temperature occurring in the detectionpart 22. More specifically, the compensation part 84 compensates thedistance output DIST based on the characteristics parameter 42 stored inthe storage part 40. The compensation distance output from thecompensation part 84 is also referred to as “DISTcomp.”

For example, when k is a linear coefficient and α and β are constantspredetermined for the characteristic parameter 42, the compensationdistance output DISTcomp can be calculated by Expression (1) below.

DISTcomp=k(DIST+α)+β  (1)

The temperature compensation process is not limited to theabove-described expression and any expression can be adopted. Thecharacteristic parameter 42 is not limited to the one-dimensionalconstants and multi-dimensional constants may be adopted. Further, acompensation amount can also be calculated by reflecting the temperaturedetected by the internal temperature sensor 38.

In the proximity sensor 1 according to the embodiment, the storage part40 stores each unique value of the proximity sensor 1 as thecharacteristics parameter 42. By adopting the characteristic parameter42 unique to each proximity sensor 1, compensation appropriate for eachproximity sensor 1 can be realized even when there is variation in thedetection characteristic change between the detection parts 22.

The compensation distance output DISTcomp may be output as a detectionresult indicating a distance (a position) to the detection object W, orinput to the threshold processing part 86 and subjected to abinarization process and the result may be output as a detection resultindicating presence or absence of the detection object W.

The threshold processing part 86 compares the compensation distanceoutput DISTcomp from the compensation part 84 with a predeterminedthreshold. When the compensation distance output DISTcomp is less thanthe threshold, a detection result indicating there is the detectionobject W is output.

FIGS. 6(A) and 6(B) are diagrams for describing a temperature change ofdetection characteristics occurring in a change in detectioncharacteristics and compensation for the temperature change. FIGS. 6(A)and 6(B) illustrate an example of a change rate of a detection distanceto a temperature. It is ideal that the change rate of the detectiondistance is zero regardless of the temperature.

For example, FIG. 6(A) illustrates an example of a temperature change ofthe detection characteristics occurring in the detection coil 16 (coil1) of a certain proximity sensor 1 and a temperature change of thedetection characteristics occurring in the detection coil 16 (coil 2) ofanother proximity sensor 1. As illustrated in FIG. 6(A), electromagneticcharacteristics are not completely uniform even when manufacturingconditions or the like are set to be the same.

For this reason, the detection characteristics after the compensationmay not be uniform even when the same compensation parameter is used.Therefore, the variation in the detection characteristics is a majorfactor hindering in an improvement in detection precision or expansionof the detectable range. That is, it is necessary to execute thedetection process on the assumption that there is a variation in thedetection characteristics, and thus the precision inevitablydeteriorates.

In the proximity sensor 1 according to the embodiment, however, thecharacteristic parameter 42 unique to each proximity sensor 1 is usedfor compensation. By using the characteristic parameter 42 unique toeach proximity sensor 1, as illustrated in FIG. 6(B), for example, thecompensation is executed on the coil 1 in accordance with acharacteristic parameter 1 unique to the coil 1 and the compensation isexecuted on the coil 2 in accordance with a characteristic parameter 2unique to the coil 2.

As illustrated in FIG. 6(B), by adopting the characteristic parameter 2unique to each proximity sensor 1, the detection characteristics afterthe compensation become substantially the same. As a result, thedetection characteristics after the temperature compensation can beuniform. Therefore, by reducing margin due to the variation in thedetection characteristics, it is possible to further improve detectionprecision and detection sensitivity. As a result, it is possible torealize an improvement in the detection precision or expansion of thedetectable range.

E. DETERMINING CHARACTERISTIC PARAMETER (MANUFACTURING METHOD)

Next, a system configuration and a processing procedure for determiningthe characteristic parameter 42 stored in the proximity sensor 1according to the embodiment will be described. Such a process may beexecuted as a part of a manufacturing process for the proximity sensor1.

In the embodiment, an ambient temperature of the proximity sensor 1 isactually changed, the distance output DIST of the proximity sensor 1occurring due to a change in the ambient temperature is measured, and avalue of the characteristic parameter 42 is determined based on themeasured value. Basically, the proximity sensor 1 is an industrialproduct. Many products of the same type are manufactured. Therefore,measuring the proximity sensors 1 one by one is impractical. The valueof the characteristic parameter 42 of the individual proximity sensor 1is determined by simultaneously measuring the plurality of proximitysensors 1.

(e1: Characteristic Parameter Determination System)

FIG. 7 is a schematic view for describing a method of determining thecharacteristic parameter of the proximity sensor 1 according to theembodiment. Referring to FIG. 7, a manufacturing system 100 of theproximity sensor 1 determines the characteristic parameter of oneproximity sensor 1 or the plurality of proximity sensors 1.

Specifically, the manufacturing system 100 includes a setting device200, a thermostatic chamber 300, an internal chamber temperature sensor302, a signal conversion device 304, a terminal board 310, a lineconcentrator 312, and a control device 314.

The setting device 200 calculates the characteristic parameter of eachproximity sensor 1 based on measurement results (an internal casingtemperature and a detected value) from one proximity sensor 1 or theplurality of proximity sensors 1 and an internal chamber temperature andsets the calculated characteristic parameter for each proximity sensor1.

FIG. 8 is a schematic view illustrating an example of a hardwareconfiguration of the setting device 200 illustrated in FIG. 7. Thesetting device 200 according to the embodiment is realized by executinga program using, for example, hardware (for example, a general PC)designed in accordance with a general architecture.

Referring to FIG. 8, the setting device 200 includes a processor 202such as a CPU or an MPU, an optical drive 204, a main storage device206, a network controller 208, communication controllers 212 and 214, aninput part 216, a display part 218, and a secondary storage device 220.These components are connected to each other via a bus 210.

The processor 202 realizes various processes to be described later byreading various programs stored in the secondary storage device 220 andloading and executing the programs in the main storage device 206.

The secondary storage device 220 includes, for example, a hard diskdrive (HDD) or a solid state drive (SSD). The secondary storage device220 includes a data collection program 222 that collects data from oneproximity sensor 1 or the plurality of proximity sensors 1, acharacteristic parameter determination program 224 that determines thecharacteristic parameter of the proximity sensor 1 based on thecollected data, and a characteristic parameter setting program 226 thatsets the determined characteristic parameter in the proximity sensor 1.The secondary storage device 220 may further store an OS and othernecessary programs. Further, the secondary storage device 220 storescollected data 228 when the characteristic parameter 42 is determined.

The setting device 200 includes the optical drive 204. A program storedin a recording medium 205 (for example, an optical recording medium suchas a digital versatile disc (DVD)) that stores computer-readableprograms in a non-transitory manner is read and installed in thesecondary storage device 220 or the like.

Various programs to be executed by the setting device 200 may beinstalled via the computer-readable recording medium 205 or may bedownloaded from a server device on a network to be installed. A functionprovided by the setting device 200 according to the embodiment isrealized using a part of a module provided by the OS.

The input part 216 includes a keyboard or a mouse and receives a useroperation. The display part 218 includes a display, various indicators,or a printer and outputs a processing result or the like from theprocessor 202.

The network controller 208 controls exchange data with another devicevia any network.

The communication controller 212 exchanges data with one proximitysensor 1 or the plurality of proximity sensors 1 via the control device314 and the line concentrator 312 (see FIG. 7). The communicationcontroller 214 acquires an internal chamber temperature measured by theinternal chamber temperature sensor 302 via the signal conversion device304.

FIG. 8 illustrates an example of a configuration in which necessaryfunctions are provided when the processor 202 executes a program, butsome or all of the provided functions may be mounted using a dedicatedhardware circuit (for example, ASIC or FPGA).

Referring back to FIG. 7, the thermostatic chamber 300 can accommodateone proximity sensor 1 or the plurality of proximity sensors 1 in thechamber and change an internal chamber temperature. That is, thethermostatic chamber 300 is an example of a device that provides atemperature-changeable environment. The internal chamber temperature ofthe thermostatic chamber 300 may be changed in accordance with a presetpattern or may be changed by an instruction from the setting device 200.

One internal chamber temperature sensor 302 or the plurality of internalchamber temperature sensors 302 are disposed inside the thermostaticchamber 300 and detect an internal chamber temperature. A detectionresult by the internal chamber temperature sensor 302 is output to thesignal conversion device 304. The signal conversion device 304 convertsthe detection result from the internal chamber temperature sensor 302into a predetermined data format to transmit the detection result to thesetting device 200. When the internal chamber temperature sensor 302 hasa communication function, the signal conversion device 304 may beomitted.

One proximity sensor 1 or the plurality of proximity sensors 1 insidethe thermostatic chamber 300 are supported by a rack or a fixing member(not illustrated). To uniformly change the ambient temperature, theproximity sensors 1 may be disposed uniformly at predeterminedintervals.

Signal lines extending from one proximity sensor 1 or the plurality ofproximity sensors 1 are connected to the terminal board 310. The lineconcentrator 312 is also connected to the terminal board 310. Theproximity sensor 1 is electrically connected to the line concentrator312. The line concentrator 312 is a device that concentrates theexchange of signals of the plurality of proximity sensors 1 and includesa communication module and a multiplexer.

The control device 314 is disposed between the line concentrator 312 andthe setting device 200, outputs signals collected via the lineconcentrator 312 to the setting device 200 in response to a request fromthe setting device 200, and provides a setting value or the like fromthe setting device 200 to the proximity sensor 1 via the lineconcentrator 312.

When the line concentrator 312 can directly communicate with the settingdevice 200, it is not necessary to dispose the control device 314.

In the manufacturing system 100 illustrated in FIG. 7, for example, ageneral industrial controller is used. For example, a programmablecontroller (PLC) may be adopted as the control device 314. In this case,the line concentrator 312 may be connected via a field network connectedto the PLC. Further, the line concentrator 312 and the proximity sensor1 may be connected to each other via a field network.

As such a field network, IO-Link, CC-Link, DeviceNet, EtherCat(registered trademark), EtherNet/IP, or the like call be used.

The proximity sensor 1 and the line concentrator 312 may be connectedvia a signal line through which an analog signal flows. However, byusing a field network, it is possible to more easily execute duplexcommunication.

(e2: Determination and Setting Procedure for Characteristic Parameter)

Next, a procedure of a process of determining and setting thecharacteristic parameter 42 stored in the proximity sensor 1 accordingto the embodiment will be described.

FIG. 9 is a flowchart illustrating a processing procedure for amanufacturing method including determination and setting of thecharacteristic parameter of the proximity sensor 1 according to theembodiment. Some of the steps illustrated in FIG. 9 are realized whenthe processor 202 of the setting device 200 executes a program.

Referring to FIG. 9, one proximity sensor 1 or the plurality ofproximity sensors 1 are disposed inside the thermostatic chamber 300 andare electrically connected to the line concentrator 312 via the terminalboard 310 (step S100). That is, the proximity sensor 1 is disposed in atemperature-changeable environment.

A trigger for measurement start is received (step S102) and the insideof the thermostatic chamber 300 is changed to a predeterminedtemperature (step S104). When the internal chamber temperature of thethermostatic chamber 300 is stabilized to the predetermined temperature(Yes in step S106), the setting device 200 acquires the internal casingtemperature and the detected value from one proximity sensor 1 or eachof the plurality of proximity sensors 1 disposed inside the thermostaticchamber 300 and stores the internal casing temperature and the detectedvalue (step S108).

It is determined whether the measurement is executed the number ofpredesignated times (step S110). When the measurement is not executedthe number of predesignated times (No in step S110), the processes ofstep S104 and subsequent processes are repeated.

In this way, the environment of the proximity sensor 1 is set to aplurality of different temperatures. The internal casing temperaturedetected by the temperature detection part (the internal temperaturesensor 38 and/or the external temperature sensor 44) of the proximitysensor 1 and the detection result output by the control calculationcircuit 32 at each temperature are stored in association with eachother.

Conversely, when the measurement is executed the number of predesignatedtimes (Yes in step S110), the setting device 200 determines thecharacteristic parameter 42 for one proximity sensor 1 or each of theplurality of proximity sensors 1 based on the stored internal casingtemperature and detected value (step S112). That is, the characteristicparameter 42 unique to the target proximity sensor 1 is determined basedon the stored temperature and detection result.

Finally, the determined characteristic parameter 42 is set for thecorresponding proximity sensor 1 (step S114). That is, a process ofsetting the determined characteristic parameter 42 in the proximitysensor 1 is executed.

With the above-described processing procedure, the determination of thecharacteristic parameter 42 and the setting of the characteristicparameter 42 in the proximity sensor 1 are completed.

The number of combinations of the internal casing temperatures and thedetected values acquired from the proximity sensors 1 is determined inaccordance with an order of an approximation expression of thecharacteristic parameter to be described below.

(e3: Process of Determining Characteristic Parameter)

Next, a process of determining the characteristic parameter 42 stored inthe proximity sensor 1 according to the embodiment will be described.

The characteristic parameter 42 is a parameter for reducing thetemperature dependency of the detection characteristics indicated by theindividual proximity sensor 1. As illustrated in FIG. 6(B) describedabove, the characteristic parameter 42 is determined so that a changerate of a detected distance is constant regardless of temperature.

More specifically, variables A₂, A₁, and A₀ are fitted so thatExpression (2) below is established using an internal layer temperatureT_(n), a reference temperature T₀, and a temperature difference ΔTbetween the ambient temperature and the internal casing temperaturedetected by the internal temperature sensor 38.

f(T _(n))=A ₂(T _(n) −T ₀ +ΔT)² +A ₁(T _(n) −T ₀ +ΔT)+A ₀ =k(constant)

That is, by fitting Expression (2) described above using the pluralityof combinations of the internal casing temperatures and the detectedvalues (for example, the distance output DIST or a change amount of thedistance output DIST) acquired from the target proximity sensor 1, thevariables A₂, A₁, and A₀ can be determined. The coefficient k calculatedusing the determined variables A₂, A₁, and A₀ can be determined as thecharacteristic parameter 42.

The internal chamber temperature detected by the internal chambertemperature sensor 302 can be used as the ambient temperature used forthe temperature difference ΔT. When the plurality of internal chambertemperature sensors 302 are disposed, the ambient temperature at aposition of interest may be estimated based on temperature detected byeach of the plurality of internal chamber temperature sensors 302 aroundthe position of interest and a distance between the position of interestand each of the internal chamber temperature sensors 302.

The Expression (2) described above is merely an example and thetemperature dependency of the detection characteristics of the detectionpart 22 (the detection coil 16) may be approximated with any function.As a variable value of the approximate function, one of the internalcasing temperature detected by the internal temperature sensor 38 and/orthe external temperature sensor 44 of the proximity sensor 1 and theinternal chamber temperature detected by the internal chambertemperature sensor 302 may be involved. Here, when the internal chambertemperature detected by the internal chamber temperature sensor 302 orthe internal casing temperature detected by the external temperaturesensor 44 is provided as information rather than only the internalcasing temperature detected by the internal temperature sensor 38 of theproximity sensor 1, precision can be further improved.

(e4: Collected Data)

Next, an example of the collected data 228 collected to determine thecharacteristic parameter 42 stored in the proximity sensor 1 accordingto the embodiment will be described.

FIG. 10 is a diagram illustrating an example of a data structure ofcollected data 228 stored in the setting device 200 of a manufacturingsystem 100 according to the embodiment.

Referring to FIG. 10, data collected from each proximity sensor 1 may bestored in a form of a sheet 2280 as the collected data 228. Each sheet2280 may include a channel number 2281 indicating to which channel ofthe line concentrator 312 the target proximity sensor 1 is connected andan identification number 2282 collected from the target proximity sensor1.

In the sheet 2280, results obtained by measuring the internal chambertemperature differently are sequentially stored. More specifically, thesheet 2280 has three columns, the internal chamber temperature 2283, theinternal casing temperature 2284, and the detected value 2285. When theinternal chamber temperature of the thermostatic chamber 300 becomes apredetermined temperature and a data collection condition isestablished, an internal chamber temperature, an internal casingtemperature, and a detected value at that time are incorporated in onerecord. When a plurality of sets (records) of the internal chambertemperatures, the internal casing temperatures, and the detected valuesare collected, the process of collecting the data is completed. The samenumber of sheets 2280 as the number of the target proximity sensors 1 isgenerated.

The characteristic parameter 42 for each proximity sensor 1 isdetermined based on the collected data 228. A value of the determinedcharacteristic parameter 42 may be stored in the corresponding sheet2280.

Content of the sheet 2280 may be transmitted to a manufacturingmanagement system (not illustrated) and may be used as information formanaging a manufacturing situation (traceability) of each proximitysensor 1.

F. CONCLUSION

The proximity sensor 1 according to the embodiment provides a morestable sensing capability by executing the temperature correctionthrough digital processing using the individual unique characteristicparameter 42. In proximity sensors of the related art, the temperaturecorrection is executed in the same way using a fixed parameter. Thus, avariation in a manufacturing process or component characteristics (inparticular, a variation in a temperature change in detectioncharacteristics) results in a change in the magnitude of conductanceoccurring in the detection coil 16, thereby causing a change in adetection distance output in a product state. The change in thedetection distance interferes in a long detectable range.

As described above, the proximity sensor 1 according to the embodimentcan minimize a change factor occurring in a detection distance byadopting the unique characteristic parameter 42 and the digitalprocessing, and thus can realize the long detectable range more easily.

In the proximity sensor 1 according to the embodiment, the temperaturecharacteristic is individually measured in the manufacturing process andthe unique characteristic parameter 42 is individually determined basedon the measurement result. Further, the individually determinedcharacteristic parameter 42 is written in the corresponding proximitysensor 1.

In the proximity sensor 1 according to the embodiment, the internaltemperature sensor 38 and/or the external temperature sensor 44 may bemounted as a part of the body 2. By using the internal temperaturesensor 38 or the external temperature sensor 44, temperature informationcan be collected more easily when the characteristic parameter for theproximity sensor 1 is determined.

By measuring an external temperature using the external temperaturesensor 44, it is possible to avoid a situation in which heat atemperature measurement value is changed due to a heat source (forexample, the power circuit 50) in the body 2. That is, by using theexternal temperature sensor 44, it is possible to reduce an influence ofthe heat source and measure the temperature of the detection coil 16which is a measurement target more accurately.

In this way, the proximity sensor 1 according to the embodiment cancommunicate information such as temperature detected by the internaltemperature sensor 38 and/or the external temperature sensor 44 with anexternal device.

In the proximity sensor 1 according to the embodiment, thecharacteristic parameter 42 is retained in a rewritable nonvolatilestorage device such as EEPROM. Therefore, the characteristic parameter42 can be rewritten easily.

In the process of manufacturing the proximity sensor 1 according to theembodiment, when the characteristic parameter 42 is determined, ameasurement value or the like used for the determination can be storedin association with information for specifying the target proximitysensor 1. Therefore, it is possible to ensure traceability for eachproximity sensor 1.

The embodiments disclosed herein are exemplary in all respects and areconsidered not to be limited. The scope of the disclosure is describedin the claims rather than the above description and is intended toinclude all modifications within the equivalent meanings and the scopeof the claims.

According to an embodiment of the disclosure, it is possible to providea method of manufacturing a proximity sensor and a manufacturing systemfor the proximity sensor capable of improving detection precision orexpanding a detectable range.

What is claimed is:
 1. A method of manufacturing a proximity sensoroutputting presence or absence of a detection object or a position ofthe detection object as a detection result, the method comprising:disposing the proximity sensor in a temperature-changeable environment,the proximity sensor including a detection part that includes adetection coil and a capacitor, an oscillation circuit that excites thedetection part, a temperature detection part that detects a temperatureinside a casing of the proximity sensor, and a control calculation partthat outputs a signal indicating a distance to the detection object asthe detection result based on a signal change occurring in the detectionpart; setting an environment of the proximity sensor to a plurality ofdifferent temperatures respectively and storing temperature detected bythe temperature detection part of the proximity sensor in associationwith the detection result output by the control calculation part at eachtemperature; determining a characteristic parameter unique to a targetproximity sensor based on the stored temperature and detection result;and setting the determined characteristic parameter for the targetproximity sensor.
 2. A manufacturing system for a proximity sensoroutputting presence or absence of a detection object or a position ofthe detection object as a detection result, the manufacturing systemcomprising: a thermostatic chamber configured to accommodate oneproximity sensor or a plurality of the proximity sensors and change atemperature environment, the proximity sensor including a detection partthat includes a detection coil and a capacitor, an oscillation circuitthat excites the detection part, a temperature detection part thatdetects a temperature inside a casing of the proximity sensor, and acontrol calculation part that outputs a signal indicating a distance tothe detection object as the detection result based on a signal changeoccurring in the detection part; a storage unit configured to set anenvironment of the proximity sensor to a plurality of differenttemperatures respectively and store temperature detected by thetemperature detection part of the proximity sensor in association withthe detection result output by the control calculation part at eachtemperature; a determination unit configured to determine acharacteristic parameter unique to a target proximity sensor based onthe stored temperature and detection result; and a setting unitconfigured to set the determined characteristic parameter for the targetproximity sensor.